Gathers electrons
Many narrow metal fingers collect electrons from across the cell's surface.
PV Efficiency Explorer
Explore photovoltaic technology developments, individual PV cell records, and PV module performance data.
FOUNDATIONS
Light is electromagnetic radiation. A solar cell responds to the energy carried by its photons, not simply to whether the light looks bright to the human eye.
Light can be described as an electromagnetic wave with wavelength λ and frequency ν, related by c = λν. It also arrives in discrete packets called photons. The energy of one photon is Eph = hν = hc/λ, so shorter-wavelength light has higher-energy photons. Sunlight at Earth's surface extends beyond the visible rainbow into ultraviolet and infrared wavelengths.
A semiconductor's bandgap Eg is the energy separation between its valence and conduction bands. A photon can generate an electron–hole pair only if it is absorbed and Eph ≥ Eg. A lower-energy photon normally passes through a simple absorber; a much higher-energy photon can be absorbed, but energy above the bandgap is rapidly lost as heat while the carrier relaxes towards the band edge.
Photon energy: Eph = hν = hc/λ
Absorption threshold: Eph ≥ Eg
Approximate cut-off: λg [nm] ≈ 1240 / Eg [eV]
The bandgap therefore sets a material's longest usable wavelength, but it does not alone determine how strongly or how deeply light is absorbed. Optical thickness, direct or indirect transitions, reflection and material quality also matter. Intensity controls how many photons arrive per unit area and time; wavelength controls the energy of each photon.
A single-junction cell cannot use every photon energy perfectly. A lower bandgap captures more of the spectrum but generally limits voltage, while a higher bandgap can support more voltage but misses longer wavelengths. Tandem and multijunction cells stack different bandgaps so high-energy photons are absorbed first and lower-energy photons can reach a narrower-bandgap cell beneath.
Scientific references: NASA electromagnetic-spectrum fundamentals, U.S. DOE photovoltaic-cell basics, and DOE wavelength and PV-loss overview.
Photovoltaics (PV) convert sunlight directly into electrical power.
Each photon carries energy E = hν. If an absorbed photon has at least the semiconductor bandgap energy (hν ≥ Eg), it can excite an electron from the valence band into the conduction band, leaving a mobile, positively charged “hole”. This process generates an electron–hole pair.
In a conventional crystalline-silicon cell, the junction between n-type and p-type silicon forms a charge-depleted region with a built-in electric field. Carriers generated in, or diffusing into, this region are separated: electrons are driven towards the n-type side and holes towards the p-type side. Carriers generated in the neutral bulk must reach the junction or a selective contact before they recombine. Metal contacts collect the separated carriers, creating a negative n terminal and a positive p terminal under illumination. With a load connected, electrons travel through the external circuit from n to p; conventional current is defined in the opposite direction.
Electrical power is P = IV. Reflection and transmission reduce absorption, excess photon energy is lost through thermalisation, and carrier recombination and electrical resistance reduce the available current and voltage. A PV cell converts energy—it does not store it—and differs from solar-thermal technology, which first converts sunlight into heat.
2 · 1955–1956
GaAs was the next major high-performance junction photovoltaic investigated after the practical crystalline-silicon cell.
Interest in GaAs photovoltaics emerged almost immediately after the 1954 silicon breakthrough. Gremmelmaier reported a GaAs photocell in 1955, and RCA researchers described experimental GaAs p–n junction cells in 1956. The first devices were small and only a few percent efficient because suitable single crystals were difficult to grow and control.
GaAs has a direct bandgap of about 1.42 eV at room temperature and absorbs sunlight much more strongly than silicon, so its active absorber can be only a few micrometres thick. Later III–V epitaxy made it possible to add lattice-matched, wider-bandgap window and back-surface-field layers that reduce recombination while allowing light and useful charge to move in the intended directions.
These cells became especially important for spacecraft because they combine high efficiency with good resistance to particle radiation. Their specialised crystal substrates, epitaxial growth and processing remain expensive, so GaAs is used primarily where performance per unit area or mass matters more than minimum cost.
Historical and device references: NASA GaAs history, representative GaAs device stack, and NREL III–V research overview.
3 · 1958
Organic photovoltaics introduced carbon-based semiconducting molecules as light absorbers and charge-transport materials.
David Kearns and Melvin Calvin reported the photovoltaic effect in laminated organic systems in 1958. Their magnesium-phthalocyanine device produced about 200 mV but extremely little power. It was primarily a scientific demonstration inspired by questions about light-driven charge separation in photosynthesis—not a practical power generator.
The field advanced when C. W. Tang's 1986 donor–acceptor bilayer showed that an interface between two organic semiconductors could separate tightly bound photoexcitations efficiently. In 1995, Yu and colleagues blended donor and acceptor materials into a bulk heterojunction, creating a nanoscale network with many charge-separating interfaces. That concept underpins most modern OPV cells.
Modern OPV can be lightweight, flexible, coloured, semitransparent and compatible with coating or printing. Its active layer absorbs light as molecular excitons; these reach a donor–acceptor interface, split into electrons and holes, and travel through selective layers to opposite electrodes. Controlling nanoscale morphology, non-radiative recombination and long-term stability remains central to development.
Historical and device references: Kearns and Calvin (1958), Tang's donor–acceptor bilayer (1986), bulk-heterojunction milestone (1995), and NREL OPV overview.
4 · 1963
Cu₂S/CdS helped turn the thin-film heterojunction from a laboratory effect into a deliberately engineered, lightweight solar-energy converter.
The technology's roots predate the 1960s: photovoltaic Cu/CdS structures were reduced to practice in 1954–1955. The 1963 NASA-sponsored large-area programme is used here as the development milestone because it addressed controlled vacuum deposition, junction formation and useful device area rather than the first observation.
In the representative front-wall architecture, light passes through a thin SiO antireflection layer and a sparse metal grid into p-type Cu₂S. That narrow-bandgap layer is the principal absorber. It meets wider-bandgap n-type CdS, which acts as the window/body of the heterojunction. A zinc layer and copper foil complete the rear contact and mechanically support the very thin semiconductor stack.
Large-area cells reached roughly 4–8% efficiency by the mid-1960s and demonstrated low material use and high specific power. Their Achilles' heel was materials stability: copper migration and changes among copper-sulfide phases altered the junction and contact properties. The programme nevertheless established methods and questions that shaped later CdTe and chalcopyrite thin-film photovoltaics.
Historical and device references: 1963 NASA large-area thin-film study, 1966 CdS-cell history and performance review, and representative Cu foil/Zn/CdS/Cu₂S/grid/SiO structure.
5 · 1972
The CdS/CdTe heterojunction established a practical all-thin-film route based on strongly absorbing polycrystalline compound semiconductors.
Cadmium compounds had shown photovoltaic behaviour earlier, but Dieter Bonnet and Helmut Rabenhorst reported the landmark all-thin-film p-CdTe/n-CdS heterojunction cell in 1972. Its roughly 6% efficiency demonstrated that useful junctions could be deposited as thin films rather than cut from high-quality single-crystal wafers.
CdTe has a direct bandgap near 1.45 eV and absorbs the solar spectrum strongly, so only a few micrometres of absorber are required. The classic superstrate design deposits a transparent conductor, thin n-type CdS window, p-type CdTe absorber and rear contact onto glass. Chloride activation, grain-boundary control and better contacts progressively improved voltage, current and manufacturability.
Modern commercial devices retain the glass-first thin-film concept but may replace or supplement CdS with wider-bandgap and alloyed front layers such as MgZnO and CdSeTe. CdTe became the leading commercial thin-film alternative to crystalline silicon, particularly for utility-scale modules. Long service life depends on stable back contacts, strong encapsulation and controlled manufacturing and recycling of cadmium-containing material.
Historical and device references: NREL CdTe history, classic glass/TCO/CdS/CdTe stack, DOE modern CdTe overview, and modern layer variants.
6 · 1976
Hydrogenated amorphous silicon made it possible to deposit a complete silicon solar cell as thin semiconductor films over large areas.
David Carlson and Christopher Wronski reported the first hydrogenated amorphous-silicon solar cell at RCA Laboratories in 1976. Their glow-discharge-deposited device was about one micrometre thick, used a p–i–n structure and reached 2.4% efficiency—modest performance, but a striking departure from sliced crystalline-silicon wafers.
Amorphous silicon lacks the repeating crystal lattice of wafer silicon. Hydrogen bonds to many otherwise electrically active dangling bonds, allowing useful doping and photoconductivity. Because carrier diffusion is limited by disorder, the p and n regions are kept very thin and a comparatively thick intrinsic absorber sits between them. The field across that intrinsic layer drives electrons and holes to opposite contacts.
Low-temperature plasma-enhanced chemical-vapour deposition enabled large-area glass modules, flexible stainless-steel products and small consumer devices. Textured transparent conductors and reflective rear contacts improved light trapping, while a-Si/a-SiGe multijunction stacks extended spectral absorption. A defining challenge is the Staebler–Wronski effect: illumination creates metastable defects and lowers initial performance, so products are characterised by stabilised rather than initial output.
Historical and device references: Carlson and Wronski (1976), NREL superstrate p–i–n structure, light-induced degradation research, and roll-to-roll multijunction manufacture.
7 · August 1976
The first CuInSe₂ thin-film heterojunction opened the path to composition-tunable chalcopyrite absorbers now known as CIGS.
Lawrence Kazmerski, Frederick White and Gary Morgan reported thin-film p-CuInSe₂/n-CdS heterojunction cells in August 1976, with efficiencies of roughly 4–5% under their test illumination. The work showed that a ternary I–III–VI₂ compound could be deposited as a polycrystalline film and coupled to a wider-bandgap n-type partner.
Adding gallium produced Cu(In,Ga)Se₂—CIGS—and allowed researchers to tune and grade the absorber bandgap. A conventional substrate cell is built on soda-lime glass coated with molybdenum, followed by p-type CIGS, a very thin n-type buffer such as CdS, intrinsic zinc oxide, a conductive transparent oxide and a front grid. Sodium from the glass and later controlled alkali treatments became important tools for improving grain growth, carrier density and interface quality.
CIGS absorbs light strongly and can be deposited by co-evaporation or by reacting metal precursors with selenium. It can also be made on flexible metal or polymer foils. Its compositional freedom enables high efficiency but makes uniform control of copper, indium, gallium, selenium, alkalis, interfaces and large-area processing demanding.
Historical and device references: Kazmerski, White and Morgan (1976), NREL standard CIGS configuration, DOE CIGS processing overview, and representative device variants.
8 · 1988
A lattice-matched GaInP top cell, GaAs tunnel junction and GaAs bottom cell demonstrated how multiple junctions could share one epitaxial crystal stack and one external circuit.
NREL's programme began in 1984, obtained a foundational tandem patent in 1987 and reported a 21.8% two-junction GaInP₂/GaAs device in 1988. The milestone belongs to the 1980s even though rapid refinement continued: a closely related monolithic device reached 27.3% in 1990.
The wide-bandgap GaInP top junction absorbs higher-energy visible photons while transmitting lower-energy light to the 1.42 eV GaAs bottom junction. Their voltages add. A heavily doped GaAs tunnel diode forms a low-loss internal series connection, so the same current must pass through both subcells and spectral current matching is critical.
Lattice matching to GaAs allowed the layers to be grown coherently by metal-organic vapour-phase epitaxy, limiting dislocations that would otherwise accelerate recombination. This architecture became the foundation for higher-order III–V multijunction cells used where efficiency and specific power justify complex epitaxial growth, especially in space and concentrator systems.
Historical and device references: NREL's 1984–1988 programme retrospective, 1990 peer-reviewed monolithic device, and current-matched GaInP/GaAs tandem patent.
9 · 1991
A molecular dye and a porous oxide separated light absorption from charge transport, creating a new kind of photoelectrochemical solar cell.
In 1991, Brian O’Regan and Michael Grätzel reported a cell built from an approximately 10 µm film of nanocrystalline TiO₂ coated with a light-absorbing ruthenium dye. Coupling the enormous internal surface area of that porous film to an iodide/triiodide electrolyte produced 7.1–7.9% efficiency under simulated sunlight and 12% under diffuse daylight in the original report.
The mechanism differs from a conventional semiconductor p–n junction. A dye molecule absorbs a photon and injects an excited electron into TiO₂. That electron moves through the oxide to the transparent front electrode and around the external circuit. The oxidised dye accepts an electron from the redox mediator, while the mediator is regenerated at a catalytic counter electrode, completing the cycle.
Dye-sensitized cells can be semitransparent, coloured and effective under diffuse or indoor illumination. Research has expanded from ruthenium complexes and iodide electrolytes to metal-free dyes, cobalt or copper redox couples and solid-state hole conductors. Key engineering challenges include electrolyte sealing, long-term chemical stability, voltage loss and interfacial recombination.
Historical and device references: O’Regan and Grätzel (1991), DOE dye-sensitized-cell principle, representative interfaces and redox chemistry, and the DOE sensitized-solar-cell roadmap.
10 · 1998
Semiconductor crystals only a few nanometres across made the absorber’s optical and electronic properties tunable through particle size.
In 1998, Arie Zaban, Olga Micic, Brian Gregg and Arthur Nozik reported the photosensitization of porous nanocrystalline TiO₂ with indium-phosphide quantum dots. Approximately 6.5 nm InP particles penetrated and adsorbed throughout the porous oxide, produced visible-light photoconductivity and injected electrons into TiO₂ in a photoelectrochemical cell containing a redox electrolyte and platinum counter electrode.
Quantum confinement is the defining idea. When a semiconductor crystal becomes comparable in size to the carrier’s characteristic length scale, its allowed energy states become discrete and its effective bandgap depends on particle size. A quantum dot can absorb a photon to create a bound electron–hole pair; interfacial energetics must then separate that pair before it recombines. In the original sensitized architecture, the electron enters TiO₂ and the electrolyte removes the remaining hole.
The field later branched into solid-state colloidal-quantum-dot films, first reported as primary thin-film absorbers in 2005, and into quantum-dot junctions, tandems and perovskite nanocrystals. Solution synthesis and size-tunable absorption—including into the infrared—are attractive, but surface traps, ligand-controlled transport, voltage deficit, oxidation, material toxicity and scalable uniformity remain central challenges.
Historical and device references: Zaban et al. (1998), NREL quantum-dot cell configurations, colloidal-quantum-dot architecture history, and the NREL/DOE review of modern CQD photovoltaics.
11 · 2009–2012
A strongly absorbing, solution-processable semiconductor advanced from a short-lived liquid-junction sensitizer to an efficient solid-state solar cell in only three years.
In 2009, Akihiro Kojima, Kenjiro Teshima, Yasuo Shirai and Tsutomu Miyasaka used CH₃NH₃PbBr₃ and CH₃NH₃PbI₃ nanocrystals to sensitize mesoporous TiO₂. The iodide cell responded to wavelengths up to 800 nm and reached 3.8% efficiency, while the bromide cell produced 0.96 V. Both used a liquid electrolyte, which dissolved the perovskite and caused rapid degradation.
The decisive step came in 2012. Hui-Seon Kim, Nam-Gyu Park and collaborators replaced the liquid electrolyte with the solid molecular hole conductor spiro-OMeTAD. Their submicrometre mesoscopic CH₃NH₃PbI₃/TiO₂ cell reached 9.7% and was substantially more stable. In parallel, meso-superstructured cells showed that perovskite was not merely a surface dye: it could transport both electrons and holes and operate as the principal semiconductor absorber.
Modern cells place an ABX₃ metal-halide perovskite film between electron- and hole-selective contacts. Composition controls bandgap, crystallisation and stability, enabling lightweight coating and high-efficiency silicon tandems. Remaining challenges include moisture, heat and light degradation; ion migration; scalable defect control; lead containment and recycling; and proving long operational lifetimes in modules.
Historical and device references: Kojima et al. (2009), Kim et al. (2012), Lee et al. (2012), and representative modern n–i–p and p–i–n stacks.
12 · 2015
A wide-bandgap perovskite top cell and a lower-bandgap silicon bottom cell divide the solar spectrum between two junctions, reducing the fundamental losses of either absorber alone.
In work first published online at the end of 2014 and appearing in 2015, Colin Bailie and colleagues made semitransparent perovskite cells with silver-nanowire electrodes and mechanically stacked them over silicon and CIGS cells. The four-terminal subcells operated independently and produced a net performance gain over the bottom cells, establishing perovskite as a practical, tuneable top-cell material.
In March 2015, Jonathan Mailoa and colleagues reported the first monolithic two-terminal perovskite/silicon multijunction. A silicon interband tunnel junction connected the subcells in series and allowed majority carriers to recombine internally. The 1 cm² device produced up to 1.65 V open-circuit voltage and 13.7% stable efficiency, although its perovskite top cell limited the series current.
The principle is spectral division: the wide-gap top junction converts higher-energy photons at high voltage, while longer-wavelength light passes into silicon. Two-terminal tandems need current matching, a transparent low-resistance interconnection and mutually compatible processing. Four-terminal tandems relax electrical matching but add transparent electrodes and optical loss. Durability, textured interfaces, large-area coating, lead management and low-cost interconnection remain central commercial challenges.
Historical and device references: Bailie et al. (2015), Mailoa et al. (2015), the NREL tandem-photovoltaics roadmap, and NREL hybrid-tandem research.
13 · 2016
Two compositionally different metal-halide perovskites divide the solar spectrum without relying on a crystalline-silicon or III–V bottom cell.
The enabling material advance came from mixed tin–lead perovskites. Replacing roughly half the lead with tin produces strong bandgap bowing, allowing a narrow gap near 1.2 eV. This made it possible to pair a low-gap perovskite rear junction with a bromide-containing, wide-gap lead-perovskite front junction near 1.8 eV.
In 2016, Giles Eperon and colleagues demonstrated the first efficient two- and four-terminal perovskite/perovskite tandems with deliberately matched bandgaps. Their monolithic two-terminal cell connected the subcells through a solvent-resistant SnO₂/ZTO/ITO recombination stack and reached 17.0% stabilized efficiency with 1.66 V open-circuit voltage. A mechanically stacked four-terminal version reached 20.3% stabilized efficiency.
All-perovskite tandems retain the thin-film, low-temperature and potentially lightweight character of perovskite PV while offering independent control of both absorber bandgaps. Their central challenges are suppressing Sn²⁺ oxidation and self-doping in the narrow-gap cell, preventing light-induced halide segregation in the wide-gap cell, forming a transparent low-loss interconnection, matching subcell currents and protecting both soft ionic absorbers during processing and operation.
Historical and device references: Eperon et al. (2016), its supporting device methods, the NREL review of mixed Sn–Pb perovskites, and the wide-bandgap tandem review.
14 · 2018
A visible-light metal-halide perovskite front cell and a near-infrared lead-sulfide quantum-dot rear cell combine two solution-processable, bandgap-tunable absorber families.
Colloidal quantum dots offered something the first perovskite tandems could not easily provide: a rear-cell bandgap tuneable below 1.1 eV simply by changing nanocrystal size. PbS quantum dots can therefore absorb red and near-infrared photons transmitted through a roughly 1.55 eV perovskite front cell, while both absorbers can be deposited from inks at comparatively low temperatures.
In March 2018, Arfa Karani, Le Yang and colleagues reported the first prototype solution-processed monolithic perovskite/CQD tandem. Its ITO/TiO₂/MAPbI₃/PTAA front cell was joined to a ZnO/PbS-CQD rear cell through a MoOₓ/ultrathin-Ag recombination and solvent-barrier stack. The best efficiency in the prototype series was only 1.01%; a separate device produced 1.17 V open-circuit voltage, demonstrating subcell voltage addition and showing that the many sequentially coated interfaces could remain intact.
The work also highlighted radiative coupling: light emitted by recombination in the perovskite can be reabsorbed by the lower-gap CQDs. Modelling predicted a 43% ideal limit for 1.55/1.0 eV absorbers and a 29.7% device using then state-of-the-art subcells. Real devices remain constrained by current matching, PbS surface traps and ligand transport, parasitic interconnection absorption, solvent compatibility, oxidation and the stability of both lead-containing absorbers.
Historical and device references: the open-access Karani et al. (2018) article, the University of Cambridge repository copy, and a review of quantum-dot tandem cells.
15 · 2019
A wide-gap perovskite top cell and a lower-gap Cu(In,Ga)Se₂ bottom cell divide the spectrum inside one lightweight, series-connected thin-film device.
Perovskite and CIGS are complementary thin-film absorbers. The perovskite converts much of the visible spectrum, while the compositionally tuneable CIGS junction uses longer wavelengths transmitted through the top cell. Earlier four-terminal demonstrations mechanically combined independently wired cells—including a 24.6% result announced in 2018—but retained duplicated electrodes and separate electrical outputs.
In 2019, Fan Fu and colleagues reported a proof-of-concept two-terminal monolithic tandem fabricated directly on a 30 µm polyimide foil. Its complete sequence was polyimide/Mo/CIGS/CdS/i-ZnO/AZO/PTAA/MAPbI₃/PCBM/ZnO nanoparticles/AZO/Ni-Al/MgF₂. The tandem sustained 13.2% efficiency and exceeded 1.75 V open-circuit voltage, showing voltage addition in a flexible stack assembled on a rough CIGS bottom cell.
The monolithic arrangement removes an electrode and connects the two junctions through the i-ZnO/AZO/PTAA recombination region. It also makes the subcells current-matched: the lower photocurrent limits the complete device. Conformal coverage over micrometre-scale CIGS texture, transparent-contact absorption, interfacial recombination, perovskite stability and mechanical fatigue therefore became central engineering problems for a lightweight tandem platform.
Historical and device references: the Fu et al. (2019) open preprint, the full device report and stack description, and imec's 2018 four-terminal tandem announcement.
16 · 2020
Three compositionally tuned perovskite junctions divide sunlight into high-, middle- and lower-energy spectral bands within one internally series-connected device.
The first monolithic all-perovskite triple-junction proof of concept appeared in February 2019. It combined approximately 1.94, 1.55 and 1.34 eV absorbers and demonstrated voltage addition up to 2.83 V, but reached only 6.7% efficiency because the rear junction severely limited current and the many solution-processed interfaces added optical and electrical losses.
In October 2020, Junke Wang and colleagues established the next practical architecture using a universal sequential two-step process for 1.73, 1.57 and 1.23 eV perovskites. Two repeated C₆₀/spatial-ALD SnO₂/approximately 1 nm Au/PEDOT:PSS interconnections protected completed subcells from later solvents while recombining adjacent charges. The monolithic device achieved 16.8% efficiency, 2.78 V open-circuit voltage and a fill factor of 0.81; stabilized output reached 16.9%.
Every series-connected subcell must carry the same current. The measured photocurrents were 8.2, 8.9 and 7.6 mA cm−2, so the 1.23 eV rear cell constrained the entire stack. Later research therefore focused on wider-gap top absorbers, current matching, suppressing light-induced halide segregation, thinner low-loss interconnections, tin oxidation control and long-term operational stability.
Historical and device references: the open-access Wang et al. (2020) triple-junction article, the McMeekin et al. (2019) first proof of concept, and a technical review of monolithic perovskite triple junctions.
17 · 2022
A wide-bandgap perovskite front cell and a narrow-gap organic back cell divide the solar spectrum while retaining a thin-film, low-temperature device architecture.
Perovskite/polymer monolithic tandems were first demonstrated in 2015, and reproducible devices exceeded 20% in 2020. The decisive post-2020 advance arrived in April 2022, when Kai Oliver Brinkmann and colleagues combined a 1.85 eV FA₀.₈Cs₀.₂Pb(I₀.₅Br₀.₅)₃ perovskite with a 1.33 eV PM6:Y6:PC₆₁BM organic bulk heterojunction. The perovskite captures higher-energy visible light; transmitted red and near-infrared photons reach the organic subcell.
The central innovation was an approximately 1.5 nm, oxygen-deficient InOx film grown by atomic-layer deposition between SnOx and MoOx. It removed the roughly 0.6 eV transport barrier found at a direct SnOx/MoOx junction while avoiding the near-infrared absorption caused by an ultrathin metal interconnect. Electrons from the perovskite subcell can therefore recombine efficiently with holes from the organic subcell.
The two subcells each supplied an EQE-integrated current density of 14.1 mA cm−2. Their voltages added to 2.15 V, enabling an 80% fill factor and 24.0% stabilized efficiency; Fraunhofer ISE CalLab certified 23.1%. The architecture showed why complementary absorbers are not sufficient by themselves: optical transmission, interface selectivity, solvent protection and an ohmic recombination contact must all work together.
Historical and device references: the 2022 Nature article, its open author manuscript and methods, and the 2015 first full-solution perovskite/polymer tandem report.
18 · 2024
Two compositionally different perovskite cells divide the visible spectrum before crystalline silicon collects the remaining near-infrared light.
Perovskite–perovskite–silicon triple junctions were first demonstrated as proof-of-concept devices in 2018. A 2022 monolithic device then exceeded 20% efficiency and reached 2.74 V. The next major architecture milestone, submitted in October 2023 and published in February 2024 by Hu and colleagues, improved the difficult middle cell and raised this technology to 24.4% efficiency.
The device combines an approximately 1.84 eV Cs₀.₂FA₀.₈Pb(I₀.₅Br₀.₅)₃ top absorber, an approximately 1.52 eV FAPbI₃ middle absorber and an approximately 1.1 eV crystalline-silicon bottom cell. Vacuum-assisted growth produced a roughly 650 nm FAPbI₃ film without the wrinkles, cracks and pinholes associated with conventional antisolvent quenching. The approximately 200 nm wide-gap top film was then added above it.
Two sputtered ITO recombination junctions connect the three subcells in series. Their measured EQE-integrated currents were 11.6, 11.0 and 15.9 mA cm−2, so the middle perovskite remained current-limiting. The champion reached 2.84 V open-circuit voltage, 11.6 mA cm−2 short-circuit current and a 0.74 fill factor; stabilized output was 24.1% after five minutes. Unencapsulated devices retained 96.6% of their initial efficiency after 1,081 hours of dark storage at 85 °C in nitrogen.
Historical and device references: the open-access Hu et al. triple-junction article, its complete device and fabrication PDF, and the 2022 device above 20% efficiency.
19 · 2025
Four compositionally tuned perovskite absorbers divide sunlight into progressively lower-energy spectral bands within one series-connected thin-film device.
Hu and colleagues reported this architecture online on 23 December 2024; its version of record appeared in February 2025 in the March 2025 issue of Nature. It is therefore shown as the 2025 milestone immediately after the earlier 2024 perovskite–perovskite–silicon triple junction.
The proof-of-concept device used approximately 2.26, 1.80, 1.55 and 1.26 eV perovskite absorbers with respective thicknesses of roughly 250, 370, 740 and 900 nm. The first two are lead-based wide-gap cells, the third is a middle-gap cell, and the rear tin–lead cell extends absorption into the near infrared.
Three transparent recombination junctions connect the four subcells monolithically. The first two use PCBM/PEI with approximately 20 nm ALD-SnOx and 10 nm IZO; the third uses C60/SnOx/IZO followed by PEDOT:PSS. The study's phenylalanine-hydrochloride precursor strategy improved the difficult 1.26 eV tin–lead film. Quadruple-junction devices reached 27.9% at 0.25 cm2, 27.4% at 1 cm2, and a best open-circuit voltage of 4.94 V. These remain laboratory proof-of-concept results rather than a commercial module architecture.
Historical and device references: the open-access Hu et al. Nature article, its archived full text and methods, and the Oxford research record and supplementary files.
20 · 2026
A small memristive region is fabricated inside the solar-cell footprint so a shaded cell can automatically bypass damaging reverse current.
Mohammadi and colleagues introduced the Memsol concept in Nature on 18 March 2026. It follows the 2025 four-junction milestone in this chronology, but it is a different kind of advance: Memsol does not add another light-absorbing junction. It integrates an adaptive protection element into a perovskite cell.
Series-connected cells can force a shaded perovskite cell into reverse bias, causing rapid degradation. The Memsol uses area-selective deposition to form a local metal–insulator–perovskite switching region that shares the cell's perovskite absorber and outer electrodes. During ordinary illuminated operation it remains in a high-resistance off state, so the photovoltaic region delivers full output. Under harmful reverse bias it changes to a low-resistance on state and carries bypass current around the shaded photovoltaic region.
The demonstrated inverted cell uses ITO, NiOx/Me-4PACz, a mixed-cation lead-halide perovskite, PZ-2HI, C60/BCP and gold. The adjacent memristive region adds patterned silver, PL-177 and SiO isolation while retaining common TCO, perovskite and gold connections. The paper demonstrated autonomous protection in a nine-cell laboratory string. One reported device reached 22.5% efficiency, and the memristor's off-state current was seven orders of magnitude below the photocurrent.
Historical and device reference: the primary Mohammadi et al. Nature article, including its device cross-section and extended reverse-bias measurements.
Plain-language overview
The lines you can see on the front of many solar cells are metal conductors. Electricity created in the silicon would be difficult to use without these lines collecting it and carrying it to the cell's outer connection.
On the sun-facing surface, connected to the electron-collecting silicon beneath it.
Many narrow metal fingers collect electrons from across the cell's surface.
Wider conductors bring the collected current to the ribbon or wire that connects the cell.
The pattern is kept narrow because metal placed on the front also blocks some sunlight.
Too little metal wastes power through electrical resistance. Too much metal shades the silicon. A good grid balances both effects.
Plain-language overview
Bare silicon reflects part of the sunlight that reaches it. This carefully designed transparent coating reduces that reflection, so more light enters the silicon and can be converted into electricity.
Across the front surface of the silicon, beneath and between the metal grid lines.
It changes how light behaves at the front surface, reducing the amount reflected away.
More light entering the silicon means more opportunities to create useful electrical charges.
Many modern coatings also reduce electrical losses caused by imperfections at the silicon surface.
Light reflected away cannot produce electricity. The coating improves light capture without being an absorber or electrical generator itself.
Plain-language overview
The emitter is a thin region near the front of the cell where the silicon has been treated with donor atoms. Together with the p-type base, it forms the junction that allows the two kinds of electrical charge to be separated.
Just below the front coating and metal grid, above the junction and the thicker base.
Its n-type silicon meets the p-type base to create the cell's charge-separating boundary.
Electrons separated at the junction are directed into this side of the cell.
The emitter carries collected electrons towards the front metal lines and external circuit.
The emitter must collect electrons efficiently without absorbing too much light, adding too much resistance or allowing charges to recombine.
Plain-language overview
Where the n-type and p-type silicon meet, a very narrow region forms with an internal electric field. This field pushes electrons one way and positively charged “holes” the other way before they can immediately recombine.
At the boundary between the thin n-type emitter and the thicker p-type base.
Fixed electrical charges on the two sides produce a built-in force inside the junction.
Electrons are directed towards the n-type side while holes are directed towards the p-type side.
Keeping the charges apart makes it possible for the cell's two terminals to have different electrical potentials.
Without charge separation, most electron–hole pairs would recombine before their energy could be delivered to the circuit.
Plain-language overview
The p-type base is the thickest silicon region in this conventional cell. When it absorbs suitable sunlight, the energy frees electrons and leaves mobile “holes”, producing pairs of charges that the cell can separate and collect.
Below the junction and above the rear contact, forming most of the silicon wafer.
Much of the useful light is absorbed within this comparatively thick part of the cell.
Absorbed light gives electrons enough energy to move, leaving holes behind.
Electrons must reach the junction while holes move towards the rear; the wafer also supports the thinner layers.
Its purity, thickness and ability to keep charges alive long enough to be collected strongly affect how much current and voltage the cell can produce.
Plain-language overview
The rear contact receives charge from the p-type side of this conventional cell and carries it into the external connection. It works together with nearby silicon and protective layers rather than acting as an isolated sheet of metal.
At the back of the silicon cell, opposite the sunlight-facing metal grid.
It receives majority-hole current from the p-type silicon with as little electrical loss as possible.
It provides the positive-side connection used to link the cell to other cells and the load.
The wider rear system can reflect unused light and protect most of the silicon from direct metal-contact recombination.
A poor rear contact can waste power through electrical resistance or charge recombination, even when the light-absorbing silicon works well.
Key principle
In the conventional cell drawn here, electrons move laterally through the n-type emitter into the metal–silicon contact, along the fine fingers, and then into a busbar or cell interconnect. The metal transports charge; it does not generate it.
Wider or more numerous metal lines intercept more incident light, reducing the illuminated semiconductor area and therefore the available photocurrent.
Lines that are too narrow, thin, long, or widely spaced increase finger, emitter-sheet, and contact losses. Resistive power loss rises approximately as I2R.
Conductor relation: R = ρL/A = ρL/(w × h). Increasing conductor cross-section lowers line resistance, while increasing its visible width also increases shading.
Conductive silver paste is commonly deposited by flatbed screen printing and then processed to form electrical contact and a conductive line.
Higher-aspect-ratio fingers can reduce shading without sacrificing cross-sectional area. Printing quality must preserve continuity, height, adhesion, and low line resistance.
Silver–copper and copper pastes, plated nickel/copper contacts, dispensing, and other printing methods are being developed to reduce cost and critical-material demand.
Grid polarity, pattern, processing temperature, and contact stack vary between PERC, TOPCon, silicon heterojunction, and tandem cells. Interdigitated-back-contact cells move both polarities to the rear and avoid front-grid shading.
| Parameter | Why it matters | Poor outcome |
|---|---|---|
| Finger width and pitch | Set the balance between shaded area and lateral collection distance. | Excess shading or emitter-sheet resistance. |
| Finger height and resistivity | Determine the conducting cross-section and line resistance. | Series-resistance loss and reduced fill factor. |
| Specific contact resistance | Describes charge transfer across the metal–semiconductor interface. | Voltage drop and local heating. |
| Continuity and adhesion | Maintain a reliable electrical path during processing and service. | Interrupted fingers, power loss, or long-term degradation. |
| Metal consumption | Affects cell cost, resource demand, and manufacturing scalability. | Higher cost and material supply pressure. |
Key principle
Silicon has a much higher refractive index than the medium above it. An anti-reflection coating introduces an intermediate optical layer whose refractive index and thickness reduce the reflected wave, allowing more usable light to enter the absorber.
Important limitation: the quarter-wave relation is a normal-incidence, lossless, single-layer starting point. A real PV coating is optimised for a broad solar spectrum, varying incidence angles, textured geometry, material absorption, the front metallisation, and the glass/encapsulant environment of the finished module.
SiNx:H is an established multifunctional front coating for crystalline silicon because its optical properties can be tuned while it also provides surface and defect passivation.
Plasma-enhanced chemical vapour deposition is widely used to form silicon-nitride films at temperatures compatible with solar-cell manufacturing.
SiOx, Al2O3, SiCx, transparent conductive oxides, and multilayer combinations are selected where different optical, passivation, or contact functions are required.
Because the dielectric coating is electrically insulating, the contact scheme must create a controlled electrical path through or around it. Conventional fired screen-printed contacts can locally form contact through the film.
| Parameter | Why it matters | Poor outcome |
|---|---|---|
| Spectral reflectance | Measures how much incident light is returned across the wavelength range relevant to the cell. | Lower photocurrent and reduced external quantum efficiency. |
| Refractive index and extinction | Control interference, index matching, and parasitic absorption within the film. | Reflection or absorption instead of transmission into silicon. |
| Thickness and uniformity | Set the optical thickness and keep the response consistent across the wafer. | Colour variation and spatially uneven optical performance. |
| Surface passivation quality | Limits recombination of photogenerated carriers at the silicon surface. | Reduced open-circuit voltage and carrier collection. |
| Thermal and contact compatibility | Preserve optical and electrical performance through metallisation and module processing. | Film damage, poor contacts, adhesion failure, or instability. |
Key principle
In the conventional cell drawn here, phosphorus donor atoms create a thin n-type region at the illuminated surface of a p-type silicon wafer. The junction field directs photogenerated electrons towards this emitter, which transports them laterally to the front metal grid.
Can reduce emitter recombination and improve short-wavelength collection, but raises sheet resistance and makes low-resistance metal contact more difficult.
Improves lateral conductivity and contact formation, but excessive active or inactive phosphorus can increase Auger and surface recombination and weaken the blue response.
Sheet resistance, R□: the resistance measured across any square of the diffused layer. It condenses the depth-dependent carrier concentration and mobility into a practical lateral-conductivity metric; it does not, by itself, fully describe recombination or contact quality.
Heavier doping beneath the metal lowers contact resistance and supports reliable contact formation.
Lighter doping between grid lines reduces recombination and improves carrier collection from the illuminated surface.
This lateral pattern decouples two requirements that a uniformly doped emitter must satisfy simultaneously.
A phosphorus source and controlled thermal cycle introduce donors from the wafer surface. POCl3 tube diffusion has long been an industrial route for forming n-type emitters.
Source concentration, temperature, time, oxidation, and etch-back determine the active-dopant profile, sheet resistance, and junction depth.
Phosphosilicate glass is removed where applicable, unwanted edge junctions are isolated, the surface is passivated and coated, and the front contact is then formed.
Laser doping, ion implantation, spin-on sources, etch-back, and direct gas-phase processes can provide local or highly controlled emitter profiles.
| Parameter | Why it matters | Poor outcome |
|---|---|---|
| Sheet resistance | Tracks lateral conductivity of the diffused region and its compatibility with grid spacing. | Series-resistance loss or an unnecessarily recombination-active emitter. |
| Dopant profile and junction depth | Define where the n region ends and how conductivity and electric behaviour vary with depth. | Weak contact formation, poor blue response, or junction non-uniformity. |
| Emitter saturation current density | Quantifies recombination associated with the emitter and its passivated surface. | Reduced open-circuit voltage. |
| Specific contact resistance | Measures electrical transfer from the emitter into the front metallisation. | Fill-factor loss and local heating. |
| Short-wavelength EQE | Reveals whether carriers generated near the illuminated surface are collected. | Loss of blue and ultraviolet spectral response. |
| Uniformity | Keeps junction depth, sheet resistance, and contact behaviour consistent across the cell. | Spatially varying current, voltage, or reliability. |
Key principle
When n-type and p-type silicon form a junction, majority carriers initially diffuse across the boundary and recombine. This uncovers immobile, positively ionised donors on the n side and negatively ionised acceptors on the p side. Their space charge produces the junction field.
Charge neutrality: NDxn = NAxp
The region extends farther into the more lightly doped side. In a heavily doped emitter on a lighter-doped base, most of the depletion width therefore lies in the base.
Approximation boundary: these relations assume a one-dimensional, abrupt, uniformly doped, non-degenerate homojunction under the depletion approximation. Real diffused emitters have graded dopant profiles, and the width also changes with applied voltage, illumination and temperature.
Diffusion and drift currents balance, the Fermi level is flat, and there is no net terminal current even though the built-in field remains.
The applied voltage lowers the effective barrier and narrows the depletion region, enabling increased carrier injection across the junction.
The effective barrier and depletion width increase. Excessive reverse voltage can lead to local breakdown, particularly around defects or non-uniformities.
Photogeneration drives the device out of equilibrium. Electron and hole quasi-Fermi levels split, producing the cell voltage while collected carriers contribute photocurrent.
Useful collection: carriers generated in the quasi-neutral emitter or base can diffuse to the junction and then be separated by its field. The depletion region is therefore not the cell's only active collection volume.
Junction loss: defects or impurity states inside the space-charge region can mediate Shockley–Read–Hall recombination, adding diode current and reducing voltage and collection efficiency.
| Parameter | Why it matters | Poor outcome |
|---|---|---|
| Dopant profile and junction position | Define the metallurgical junction and the charge available on each side. | Non-uniform field, poor contact integration, or inconsistent response. |
| Depletion width and capacitance | Describe how the space-charge region changes with bias and doping. | Unexpected collection, speed, or voltage-dependent behaviour. |
| Built-in potential and field profile | Set the electrostatic barrier and carrier-separation force. | Weak selectivity or increased carrier loss. |
| Space-charge recombination | Tracks trap-assisted loss within the depleted junction volume. | Higher dark current and lower open-circuit voltage. |
| Ideality and dark-current components | Help distinguish junction recombination from diffusion and shunt mechanisms. | Misidentified loss mechanism or weak fill factor. |
| Reverse leakage and breakdown | Indicate junction uniformity and behaviour under cell mismatch or shading. | Local heating, instability, or permanent damage. |
Key principle
Acceptor dopants—commonly boron in a conventional p-type wafer—make holes the equilibrium majority carriers. Illumination creates additional electron–hole pairs throughout the silicon. The base must let the minority electrons diffuse to the junction before they recombine, while holes remain available for transport towards the rear, hole-selective contact.
Minority-electron diffusion length in the p-type base.
Low-field resistivity approximation for fully ionised, non-degenerate p-type material.
Design interpretation: a longer τn gives electrons more time to reach the junction and increases Ln. High collection is favoured when the relevant travel distances through the base are not large compared with the effective diffusion length; the exact criterion depends on the optical-generation profile and boundary conditions.
A thicker base can absorb more weakly absorbed, long-wavelength light and can be mechanically easier to handle. Optical texturing and rear reflection can extend the light path without an equal increase in silicon thickness.
Extra thickness increases the volume in which bulk recombination can occur and can place some generated electrons farther from the junction. Thinner wafers also reduce silicon use, but demand effective light trapping and careful handling.
Transition-metal impurities, crystal defects and defect complexes introduce electronic states that shorten minority-carrier lifetime. Their effect depends on defect density, capture properties and injection level.
Radiative recombination and Auger recombination remain even in very pure silicon. Auger loss becomes increasingly important at higher carrier or dopant concentrations.
An unpassivated rear interface or direct metal–silicon contact can remove carriers rapidly. Rear passivation, local contacts and back-surface fields are used to reduce this loss.
Boron-doped Czochralski silicon can exhibit boron–oxygen-related light-induced degradation; p-type technologies may also be susceptible to light- and elevated-temperature-induced degradation.
Too little acceptor doping: raises bulk resistivity and can increase series-resistance or contact-design constraints. The full cell design, injection level and contact geometry determine the practical consequence.
Too much acceptor doping: can increase intrinsic recombination, reduce minority-electron lifetime and alter the junction saturation current. A useful design balances conductivity, voltage and carrier collection rather than maximising dopant concentration.
| Parameter | What it reveals | Poor outcome |
|---|---|---|
| Conductivity type, acceptor density and resistivity | Confirm the base polarity and quantify the conductivity set by doping and mobility. | Excess resistance or an unsuitable junction/contact design. |
| Wafer thickness and variation | Set optical path, material use, handling strength and characteristic carrier travel distances. | Optical loss, breakage, or spatially inconsistent current. |
| Minority-carrier lifetime, τn | Measures how long excess electrons persist before recombination under stated conditions. | Lower collection and larger recombination current. |
| Effective diffusion length, Ln | Links electron diffusivity and lifetime to transport through the neutral base. | Long-wavelength carriers recombine before collection. |
| Bulk and rear recombination | Separates material-quality loss from rear-interface and contact loss where the method allows. | Reduced open-circuit voltage and external quantum efficiency. |
| Spatial uniformity and degradation response | Maps crystal defects, contamination and changes under light and temperature stress. | Cell mismatch, local weak regions, or unstable output. |
Key principle
In the conventional p-type-base cell drawn here, the rear electrode is the positive terminal under illumination. A useful rear-contact system is not just metal: it combines the silicon surface, any p⁺ region or dielectric passivation, the openings that permit charge transfer, the metal layer or grid, and the points used to interconnect the cell.
The lightly or moderately acceptor-doped wafer body and main absorber. It conducts holes towards the rear but is not itself the metal contact.
A more heavily doped silicon region or a passivating-contact stack reduces minority-electron access to a recombination-active metal interface.
The highly conductive layer or grid that spreads current and connects the cell externally. Aluminium is common in the architectures illustrated.
Specific contact resistivity for an approximately uniform current density at the interface.
Resistive power loss from the combined contact, constriction, metal and interconnection resistance.
Measurement boundary: local rear contacts do not carry uniform current. Their measured resistance includes current crowding and lateral transport in the silicon and metal, so a contact test structure and extraction model must match the geometry being evaluated.
Larger contact area lowers constriction and interface resistance and spreads current more easily, but exposes more silicon to a highly recombination-active metal interface and blocks rear-side light in bifacial designs.
Smaller or more widely spaced openings reduce contacted-area recombination and improve rear optical design, but increase current crowding and lateral resistance if the spacing or contact quality is inadequate.
| Architecture | Rear structure | Principal consequence |
|---|---|---|
| Full-area Al-BSF | Aluminium paste is fired against much of the p-type silicon rear, creating an alloyed p⁺ region beneath the metal. | Simple, conductive and mature, but with greater rear recombination and weaker optical passivation than a well-made PERC rear. |
| Monofacial PERC | A dielectric passivation stack covers most of the rear; local openings connect the silicon to a broadly covering aluminium electrode. | Reduces rear recombination and improves internal reflection while retaining a conductive rear metal layer. |
| Bifacial PERC | Patterned rear metallisation leaves areas optically open rather than covering the full rear with opaque aluminium. | Accepts rear illumination, but the grid resistance, shading and external contacting method become important. |
| Passivating contacts and back-contact cells | Carrier-selective stacks, transparent conductors, plated metals or interdigitated polarities can replace the illustrated Al/Si arrangement. | Can reduce recombination substantially, but use different transport paths and should not be interpreted using the simple rear-electrode schematic alone. |
Small effective contact area, incomplete firing, discontinuous metal, narrow rear fingers or poorly placed test probes raise series resistance and reduce fill factor.
Too much exposed silicon, weak surface passivation, insufficient field-effect selectivity or process damage increases rear saturation current and lowers voltage.
Local-contact geometry and firing conditions affect Al–Si alloy formation. Voids, spikes or irregular local back-surface fields can impair electrical and mechanical uniformity.
Poor adhesion, cracks, fatigue, corrosion or degraded conductive bonds can increase resistance or electrically isolate regions during module service.
| Parameter | What it reveals | Poor outcome |
|---|---|---|
| Specific contact resistivity and contact fraction | Quantify charge transfer at the interface and the amount of directly contacted silicon. | Contact voltage loss, current crowding, or excessive recombination. |
| Metal sheet resistance and geometry | Describe lateral current spreading through a full-area layer or patterned rear grid. | Fill-factor loss and spatially non-uniform current extraction. |
| Rear recombination current or velocity | Measures minority-carrier loss associated with passivated and metallised rear regions. | Lower open-circuit voltage and weak long-wavelength response. |
| Rear internal reflectance | Tracks how effectively transmitted light is returned to the silicon absorber. | Reduced near-band-edge absorption and short-circuit current. |
| Contact-opening and alloy geometry | Checks opening width, pitch, local p⁺ formation, voiding and process uniformity. | Electrical variation, shunting, weak adhesion or incomplete contact. |
| Adhesion and accelerated-aging response | Tests metallisation and interconnection stability under mechanical, thermal and environmental stress. | Corrosion, fatigue, delamination, rising resistance or open circuits. |